lightbulblarge_03

We offer the following services to our customers…

  • Simple through complex PCB design solutions
  • High speed design experts
  • Analog and RF and Power Supply design
  • Custom footprint, pad stack and library creation following IPC 7351
  • Constraint driven rule management
  • FPGA & Asic Pin-out optimization & route study
  • Stack up verification
  • Signal Integrity and EMI compliance certification
  • Bullet proof design process built around structured reviews and client communication
  • Expert project management from concept through manufacturing
  • Design for Manufacturability performed using Valor Enterprise 3000
  • Circuit Board Design and Layout

Expertise with the following technologies…

  • High speed frequencies to 40Gbps
  • Mixed Technology – Flex, Analog, RF, Power,
  • Mesh
  • High Density Interconnect – Blind & Buried Via
  • / Micro Via /
  • Via in Pad
  • DDR3 / DDR2 / DDR / Rambus / SDRAM / QDR
  • Pier / PCIX / PCI / HyperTransport / QPI / Rocket
  • IO / XAUI / SERDES / SPI-4 / AGP
  • USB / Firewire / Spacewire / Serial ATA
  • 1GbE and 10GbE / InfiniBand
  • HDMI / DVI / Composite Video / S Video / VGA
  • 4G LTE WiMax / 802.11a, b & g / Bluetooth / GPS
  • Highest layer count – 44 layers
  • Highest Pin Count – 60,564 pins
  • Largest BGA – 1mm pitch – 2,700 pins
  • Smallest BGA – .4mm full matrix
  • Most Complex HDI – 28 layer, 7 lamination cycles,
  • blind-buried-micro-stacked vias

DFA / DFM-Valor Enterprise / Trilogy

Enterprise

  • Automated fabrication rule checking
  • No data leaves without check
  • 10+ years of refinement
  • Eliminates fabrication errors or delay
  • Trilogy
  • Automated assembly rule checking
  • BOM
  • Component spacing
  • Footprint to independent model
  • Eliminates costly symbol errors